Electronics Forum | Wed Feb 05 14:20:45 EST 2003 | Stephen
One thing that worked for me was simply rounding off the pads, making square pads into circlesfor the stencil. It worked but did seem a little strange turning squares into circles for 0603's and 0402's and turning cirlces for BGA's into squares, (bu
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills
Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Sat Jan 15 18:02:32 EST 2005 | jgarver1
What kind of component mix do your products require? (0201, 0402, BGA, QFP, etc.) This information can help everyone make suggestions.
Electronics Forum | Wed Dec 22 08:49:55 EST 2004 | markhoch
I'm looking for some data to support my argument that HASL boards are not the most ideal boards for manufacturing involving BGA's and 0402's. I'm sure one of you SMT Gurus out there can point me in the right direction! Thank you in advance!
Electronics Forum | Wed Jun 23 19:40:29 EDT 2004 | Deon Nungaray
Quick question for you Netters out there: Anyone out there dispense solder paste (via automated dispenser) for 0402, 0201 and/or uBGA's? If so, success yields, equipment used, and any technical info would be appreciated. This is for a low volume app
Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
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