Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Mon Jul 16 11:25:22 EDT 2007 | davef
For the problem part, describe the pads on the board and the aperatures on the stencil.
Electronics Forum | Mon Jul 16 16:42:40 EDT 2007 | pnguyvu
Hi Jacky, It seems you have solder bead problem, beading occurs when the solder paste brick splatter as a component is placed into it, after reflow, the splatter becomes a spherical solder ball. Hope this will help. Steve USA STENCILS
Electronics Forum | Fri Jul 20 16:39:18 EDT 2007 | john_smith
Jacky, we have had a similar problem. We needed to go to a smaller nozzle and also check your vacuume system and air kiss.Could be after placement when the machine blows air to insure the part is off the nozzle that it is effecting the solder brick.
Electronics Forum | Thu Apr 12 00:43:38 EDT 2001 | zam_bri
Can anybody gimme some input on the problem I faced currently on 0402 Chip Resistor. At pre-reflow the component are placed nicely but at post reflow, we found the Resistor stands sideway ( both termination, the pad and componant are in contact, fun
Electronics Forum | Thu Apr 12 02:30:18 EDT 2001 | zam_bri
Thanx for your valuable feedback,Eric. Do you mind sharing with me the pad size change that you have made. I mean from what size to what size. I'm measuring mine now...cheers
Electronics Forum | Sun Apr 15 23:12:00 EDT 2001 | Eric Chua
The size i had changed from 55 x 20 mils to 42 x 20 mils. The component size i have is 40 x 20 mils ( 1mm x 0.5mm ).
Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C
Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't
Electronics Forum | Mon Sep 20 16:46:47 EDT 2004 | cristiano
Do you have any information about the best standart for 0402" chip pad design. I have found differents recomended dimensions from IPC standart and manufacturer(AVX) . Which should be the best one? Thanks
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
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