Electronics Forum | Thu May 10 09:57:22 EDT 2001 | zam_bri
Hi Cal/Dave F, Good news today. The problem went away when I received and ran with a brand new component today. But I'm sure with a robust profile, I should be able to compensate oxidations at some degrees, rite? ( taking into consideration the suc
Electronics Forum | Wed May 09 15:15:52 EDT 2001 | caldon
Your process needs some refining. How long did it take to wet? How much force did it take to break the surface tension? What type of solder was in the solder pot? What type of flux was used? What was the pot temperature? Did you take a cap and p
Electronics Forum | Thu May 10 10:27:29 EDT 2001 | davef
It depends ... * Components stored in a garage in Chiriqui,Panama will have a different shelf life than those store in a climate controlled room in Ayrshire, Scotland. * Components from a reputable supplier will likely have a different shelf life tha
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef
Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran
Electronics Forum | Wed Apr 12 21:33:27 EDT 2000 | Micah Newcomb
Billy and Chris have a good point, pad size and geometry will affect proper aperture size and geometry and could result in tombstoning. Also I have seen chips which require special pastes but I have never found this to be the cause of tombstoning, in
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
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