Electronics Forum: 0402 components essemtec (Page 1 of 56)

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402

Electronics Forum | Thu Jun 09 09:08:09 EDT 2005 | russ

It's normal for us when we review design. We have found that in the Y axis we need .015" whereas in the X axis we can use .005" spacing. this relates to our nozzle size vs. pickup skew etc... This wouldn't apply if there are parts taller than XXX

0402

Electronics Forum | Thu Mar 03 19:10:44 EST 2011 | fordf1502004

We are using Universal's Hsc for our production. the problem we are having is we are placing 0402 with a 8mm feeder with a pitch of 2, while running production, the feeder continues to advance with a pitch of 4. anyone have an idea as to why. the com

Glue on 0402 components

Electronics Forum | Tue Nov 03 10:56:07 EST 2009 | dcell_1t

0402 will be glued on a fuji GL

Placing 0402 components

Electronics Forum | Wed Dec 23 09:47:41 EST 1998 | David Trent

I am trying to place 0402 components using a Fuji CP2. Does anyone have experience doing this? Are there any tricks to this that I need to know about? Thanks

Glue on 0402 components

Electronics Forum | Mon Nov 02 19:04:14 EST 2009 | dcell_1t

Hi there, I'm looking for some info on how to glue 0402 components... I wonder if you can share some info, I think is pretty hard and I want to know your experiences. thanks!

Glue on 0402 components

Electronics Forum | Tue Nov 03 16:28:53 EST 2009 | davef

We have never dispensed adhesive for 0402, but here's your rules of thumb: * Nozzle diameter should be half the desired glue dot diameter. * Minimum of 0.010" gap between the adhesive and pad, both sides. We'd guess that you should be using a 0.3mm

Re: 0402 components

Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX

Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).

Re: 0402 components

Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX

Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).

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