Electronics Forum | Wed Jan 07 05:53:05 EST 2009 | sm2009
Hello, does anyone know if it's possible to wave solder 0402 components? Are there drawbacks? Where can I find technical details about recommended footprint and glue point? Last question: are there suggestions about wave soldering for ic with 0,635mm
Electronics Forum | Wed Apr 18 09:31:24 EDT 2007 | aj
Hi, Can you advise the footprint dimensions used on the PCB ? Thanks, aj...
Electronics Forum | Sat Apr 14 04:33:44 EDT 2007 | aj
the footprint is IPC standard which I have found to be less forgiving than the Jedec one for tombstoning. Enig finish - 5 thou stencil. We have historically used homeplate design but I am leaning towards 1:1. Leadfree application. aj...
Electronics Forum | Wed Jan 07 07:50:24 EST 2009 | ludee_circuits
I think so. My customer once assembled resistors 0402 ,by Glue+wave soldering process. But PCB must be printed soldermask bridge between 0402 SMD PADs, otherwise you would encounter short problem. Sorry I don't have any comment for recommended footp
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed Feb 26 15:27:21 EST 2003 | robert valles
Sounds like someone before you was dealing with tombstoning components. We have had greater success with triangular paeratures for 0603 and 0402 footprints. Granted the pad will not be wetted completly but IPC requirements are maintained.
Electronics Forum | Mon Sep 18 11:30:43 EDT 2006 | aj
Hi All, What is the difference between the above? Came across some conflicting design rules between the two - in particular 0402 smt footprint. aj...
Electronics Forum | Fri May 12 05:47:18 EDT 2000 | Wolfgang Busko
Just another thing to look at: Look in the archives of IPCs technet. There I found this interesting this interesting link http://www.plexus.com/In_The_News/Papers/papers.html and an interesting article (in PDF format) about "tombstoning of 0402's a
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Mon Aug 21 04:20:49 EDT 2006 | Rob
Hi Mika, I used to work for the largest chip cap manufacturer in the world, and by far the largest problem we would see was cracking due to incorrect z height adjustment on Chipshooters. It can also cause solderballs and bad joints by displacing th
