Electronics Forum | Mon Oct 06 02:24:35 EDT 2008 | gang
thank you very much
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Fri Sep 26 12:19:09 EDT 2008 | davef
For the IPC Land Pattern Viewer, look here: http://landpatterns.ipc.org/default.asp
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin
I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad
Electronics Forum | Mon Jan 17 12:23:47 EST 2005 | Dan Gosselin
Thanks for your input. What would you say is the biggest defect condition you see with 0402's? ANy difference with 0402 caps vs. resistors? Dan
Electronics Forum | Fri Jan 14 12:59:07 EST 2005 | Dan Mendoza
I have used the rectangle shapes and round shapes with no noticible difference. The idea is to design the pads to accept the same solder volume per component. Components over two size pads will favor the higher solder volume side during reflow.
Electronics Forum | Fri Jan 14 14:59:52 EST 2005 | russ
We use a 25 x 25 mil square pad with a 18-20mil GAP with great success. Russ
Electronics Forum | Wed Jun 17 16:00:47 EDT 1998 | Frank
| | Does any one wave solder the 0402 Chips on the bottom side of a board? | | Any comments? | You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the
