Electronics Forum | Sat Apr 18 09:44:46 EDT 2009 | davef
Low tombstone pastes have been around for 8-10 years. Talk to your paste supplier about suggestions of the "latest and greatest." Usually these pastes: * Are a blend of alloys with slightly different melting points * Have a mid-level activity flux *
Electronics Forum | Fri Apr 23 12:26:27 EDT 1999 | Jeff Anweiler
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | "Mesh Size" is a term that is commonly use
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Wed Apr 14 17:39:20 EDT 1999 | Dave F
| Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | I consider "fines" individual unmelted metal spheres that are found in s
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
Electronics Forum | Wed Aug 11 11:54:50 EDT 1999 | Dave F
| | Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulati
Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian
| Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
