Electronics Forum: 0402 size (Page 1 of 17)

Re: 0402 package size

Electronics Forum | Tue Jun 06 20:02:55 EDT 2000 | Dave F

Ravi: I agree with travis. What's the issue?

0402 package size

Electronics Forum | Fri Jun 02 19:43:40 EDT 2000 | Ravi Bhat

One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards

Re: 0402 package size

Electronics Forum | Tue Jun 06 17:20:05 EDT 2000 | Travis Slaughter

There is no difference in 0402�s on the bottom side than 0603 0805 1206. They will not fall off or tombstone, unless they where before you put them in the oven.

0402

Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo

Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen

0402

Electronics Forum | Thu Jun 09 09:08:09 EDT 2005 | russ

It's normal for us when we review design. We have found that in the Y axis we need .015" whereas in the X axis we can use .005" spacing. this relates to our nozzle size vs. pickup skew etc... This wouldn't apply if there are parts taller than XXX

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402 bridging

Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey

Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas

0402 bridging

Electronics Forum | Tue Jun 02 15:01:57 EDT 2015 | tombstonesmt

What is the reduction in aperture size for your stencil versus pad? Or are they at 100%?

0402 tombstones

Electronics Forum | Sat Apr 18 09:44:46 EDT 2009 | davef

Low tombstone pastes have been around for 8-10 years. Talk to your paste supplier about suggestions of the "latest and greatest." Usually these pastes: * Are a blend of alloys with slightly different melting points * Have a mid-level activity flux *

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