Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist
On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.
Electronics Forum | Sat Apr 18 17:42:07 EDT 2009 | billwestiet
I like this suggestion the best as a "band aid", check out some of the low tombstoning solder pastes. I've seen these work.
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Fri Apr 17 10:44:29 EDT 2009 | rmitchell
Hi, follow up, Thanks to everyone that responded. We finished the build, the sun burst thru the clouds and the birds sang. Well that was a slight exageration. Sorry for lack of detail on the original post, I was frazzled. Since the 0201's were p
Electronics Forum | Mon Jul 16 16:42:40 EDT 2007 | pnguyvu
Hi Jacky, It seems you have solder bead problem, beading occurs when the solder paste brick splatter as a component is placed into it, after reflow, the splatter becomes a spherical solder ball. Hope this will help. Steve USA STENCILS
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Tue Jul 18 16:14:45 EDT 2023 | daniel_stanphill
I remember having seen an ad on LinkedIn or somewhere that showed a handheld pen capable of manual deposits even on 0402 and 0.4mm fine pitch pads. I have been trying to search for it today and am seeing some comparable products but nothing that look
Electronics Forum | Mon Apr 16 09:58:55 EDT 2007 | davef
"Although some lead-free pastes performed adequately and newer pastes work better than earlier formulations, this detailed experiment confirmed that tin/lead solder pastes wet back to PCB pads better than lead-free solder pastes. Therefore, a more ac
Electronics Forum | Fri Nov 24 05:38:46 EST 2017 | jineshjpr
Can anybody suggest how to reduce 0402 LED tilting as I am using Convectional Reflow oven with 10 Heating zones and controlling the solder paste with 4.2 mills paste height
