Electronics Forum | Fri Nov 15 00:08:01 EST 2019 | ramesh_10377
hi i recommend following actions. 1) check the location where most solder ball is finding 2) verify the printer setting parameter if the problem is still persisting please go below action 1. Stencil thickness should be 4 mil 2. Aperture ope
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Mon May 27 16:17:30 EDT 2013 | nikyta
Hi Eric, you have the right reduction on the stencils apertures? Also, a very oxidized solder paste can -and will do- promote and increase both the tombstoning as well as the solder balls.
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Mon May 27 15:11:25 EDT 2013 | ericrr
Interesting, I could not find anything via a website search some of the links came up as 404, others a "home" page and some never went at all (or took too long) So I turned to google and found http://www.smtinfo.net/docs/tombstoning.pdf a 16 page a
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Tue Sep 08 23:12:57 EDT 2020 | SMTA-64387687
Have you tried rotating the board 90 or 180 going into the oven? With inductive components there's a possibility of magnetic current buildup, that pulls the component to one of the pads. Although, I've only seen it on larger inductors. Also, the pres
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Thu Mar 02 13:04:22 EST 2006 | Chunks
0603 parts at .2mm spacing is pretty easy. But are there any other parts, like fine pitch QFPs? Is your board HASL or something else? Is there resist/mask between all pads? If it's just 0603's at .2mm, then you can probably go 7 mils and get good
