Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Tue Aug 29 10:55:12 EDT 2000 | Steve Thomas
Earl, I emailed you prior to seeing your very informative post. Let me know if you got it so I know if that's a valid email or not. Very interesting. We clearly have some thinking to do.....
Electronics Forum | Mon Aug 28 18:21:13 EDT 2000 | Earl Moon
Steve, If interested in more vital input - contact me offline. It's not just the factors you indicate but those of reliability. Earl Moon
Electronics Forum | Tue Aug 29 11:24:39 EDT 2000 | Earl Moon
Steve, Didn't get it. Send only to pod@ix.netcom.com and please include your real email address for reasons previously stated and obvious to all. Look forward to talking with you about a very interesting and important subject. Enjoy, Earl
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Wed Feb 29 06:33:49 EST 2012 | amitsindwani
Please define the defect in following conditions & link to IPC 610 clause/sub-clause no.: 1. 0603 component placed on 0805 PCB pad 2. 0805 component placed on 0603 PCB pad 3. 1206 component placed on 1210 PCB pad and 4. 1210 component placed on 1206
Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu
Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi
Electronics Forum | Thu Jan 24 01:14:28 EST 2002 | GregH
What will be the effect on the above with regards, to solderability, solder joint strength, electrical characteristics etc. thanks and best regards in advance.
Electronics Forum | Tue Jun 27 10:36:45 EDT 2000 | Bill Bannister
We've been experiencing solder balls on 0805 caps. We have modified the reflow profile and had some success, but some balling still persists. The balls always form from under the cap between the lands. I measured the distance between the lands at .03
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
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