Electronics Forum | Mon Feb 06 06:35:28 EST 2006 | dougs
Sr Tech could be right about the C-AXIS coupling, i've seen that happen before as well, although the noise happened when the cam was sitting still at 0deg, not when it was turning, the noise was from the motor hunting for position.
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
Electronics Forum | Wed May 03 10:18:43 EDT 2000 | Stefan Witte
Greg, at least on three different brand machines, I was working on, the offsets rotated with the board. If you start out at 0 deg. and the offset in the top left corner than it is on top right at 90 deg., bottem right at 180 deg. and bottem left at 2
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Tue Apr 28 19:43:25 EDT 1998 | Michael Allen
I'd like to find a buyer for the following used equipment: Make: Universal Instruments Model: 4713D Adhesive Dispenser Options: Rotatable dual-dot head (0deg, 90deg) Price: Asking $4K (No reasonable offer refused) I should note that this d
Electronics Forum | Fri Jan 16 07:48:29 EST 2004 | Mika
We usually program the components in the component database with pin 1 in the lower left corner. Then in the feeder database we set the component orientaion to 270 deg for Tray feeders(turn the tray in the feeder 180 deg) and "tube" feeders. For tape
Electronics Forum | Thu Aug 14 18:04:36 EDT 2008 | smt_guy
I have made couple of investigations with our oven. I set-up 5 product profiles and run a thermal profile measurement and record them. Then I set-up one more product profile and rename that as Validation Profile then measured the thermal profile. A
Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
Electronics Forum | Tue Apr 28 23:48:20 EDT 1998 | Jojo
| I'd like to find a buyer for the following used equipment: | Make: Universal Instruments | Model: 4713D Adhesive Dispenser | Options: Rotatable dual-dot head (0deg, 90deg) | Price: Asking $4K (No reasonable offer refused) | I should note
Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
