Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
Electronics Forum | Fri Dec 31 03:04:24 EST 2004 | Colin G
0805 is 80 thou by 50 thou. As there are 40 thou per mm, this is therefore a device which is 2mm by 1.25mm, i.e., a 2125 Cheers, Colin...
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Wed Apr 26 05:03:30 EDT 2006 | Darren
Hi We have a new product that has a 22uF 0805 X5R 6.3V Chip Cap. It is placed on standard 0805 pads but is 1.25 mm high and although we are not getting the best fillet it appears sufficient. The trouble is we are getting a small number of returns
Electronics Forum | Tue Nov 01 09:16:03 EDT 2011 | austinpeterman
Hello, Looking for a solution to silicon conformal coating wicking up into connectors. We build IPC-A-610 class 2. We are using a PVA 650 with Dow Corning 1-2577 conformal coating. We have solder joints that must be coated 1.25mm from the connecto
Electronics Forum | Mon Aug 19 10:25:19 EDT 2013 | jaimebc
Using ERSA Ecoselect. I am curiuos to hear from other selective solder users as to what is the ideal lead lenght for your application on thru hole components. Shorter leads have helped us decrease solder bridges. We find ours to be from .75 mm to 1
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
| 1 |
