Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC
Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4
Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Tue Sep 20 14:13:43 EDT 2005 | Rich
I use Cad2Cad v1.5 with Phillips Topaz. I don't know how much is differs, try this: Converting data to a Philips VIOS Text File format: 1. Open the pick and place data in Excel and format it to look like table 1. ** Make sure you delete the �mm�
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
| 1 |
