Electronics Forum: 10 (Page 1010 of 1927)

splicing conveyor belting

Electronics Forum | Mon Oct 06 15:03:42 EDT 2003 | ssnow

I would like to hear from anyone who has ever successfully spliced conveyor belts, or who know's where I can get my hands on a splicing iron. I have belts that are broken or just need lenght modifications. please let me know if anyone does this and w

splicing conveyor belting

Electronics Forum | Mon Oct 06 18:24:34 EDT 2003 | pjc

what type of belt is it and what material is it? round belt, flat belt, etc... if its from a PCB transport conveyor or other PCB handling system, I recommend you contact the OEM. I have spliced belts before- rubber round belt off old Fuji loader and

Corrosion

Electronics Forum | Mon Oct 06 15:48:21 EDT 2003 | Adam

Please help, we have by mistake repaired some boards using the wrong flux (water soluble on a no clean board). Unfortunatly we found out later on while we are testing the boards. The lab anyalysis clearly showed that the flux has eaten through the

Corrosion

Electronics Forum | Mon Oct 06 16:18:30 EDT 2003 | pjc

If the flux is already eating thru Cu it must have been some time since the boards were soldered with the OA flux. Ionic contamination testing (with OmegaMeter or IonoGraph)can be done to find contaminated boards and cleaning the boards can be done

Corrosion

Electronics Forum | Mon Oct 06 17:16:02 EDT 2003 | pjc

Yes, the OmegaMeter and IonoGraph are test equipment to measure ionic contamination. Either of those units should enable you to sort your inventory boards. for more info about this equipment, go to: www.cooksonee.com/products/scs/CoatingSystems/Ionic

Corrosion

Electronics Forum | Wed Oct 22 17:26:59 EDT 2003 | Terry Munson

Yes Ion Chromatography can when using a isolated extraction system called the C3 tester. Please email me or call of-line and we can show you what we have done for others to not only idendity the flux cleanliness levels but to qualify the cleaning pr

PCB Au thickness

Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef

J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin

Wiring LED's

Electronics Forum | Thu Oct 09 16:59:39 EDT 2003 | davef

Look here: http://www.acroname.com/howto/LED/LED.html If you don't know the current, experiment with different values of resistor. Starting with the highest value resistor that doesn't dim the light too much then lowering it as needed. Connect th

Re-Reflowing PCB's

Electronics Forum | Mon Oct 13 11:01:25 EDT 2003 | markhoch

Our customer is starting to see some solder joint failures during their extensive testing proceedures. Specifically with an SMD/DIP device that has a very small foot in relationship with the pad on the PCB. (By SMD/DIP device I mean a DIP IC that has

Re-Reflowing PCB's

Electronics Forum | Tue Oct 14 09:13:14 EDT 2003 | davef

To us, time above liquidous plus 20*C is more important than the 60 sec [er what ever] above 183*C [which we think is meaningless] that the fine solder paste supplier suggest. Based on what you've told us and lacking any failure analysis, we'd gue


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