Electronics Forum | Mon Oct 13 11:01:25 EDT 2003 | markhoch
Our customer is starting to see some solder joint failures during their extensive testing proceedures. Specifically with an SMD/DIP device that has a very small foot in relationship with the pad on the PCB. (By SMD/DIP device I mean a DIP IC that has
Electronics Forum | Tue Oct 14 09:13:14 EDT 2003 | davef
To us, time above liquidous plus 20*C is more important than the 60 sec [er what ever] above 183*C [which we think is meaningless] that the fine solder paste supplier suggest. Based on what you've told us and lacking any failure analysis, we'd gue
Electronics Forum | Tue Oct 14 23:30:38 EDT 2003 | Dean
Get high magnifiction micro structure analysis of the failed joints. I bet you will see the correct grain structure. What about the other part types? Any failures? I assume this is standard 63/37 Eutectic solder? These aren't heart monitors or
Electronics Forum | Mon Oct 13 16:39:19 EDT 2003 | lgroves
Hi Andrea, Another good place to start in addition to the oven manufacturer is your solder paste vendor. They can help you select the correct paste and give you the right reflow profile to use for that paste. Keep in mind that most vendors (paste, s
Electronics Forum | Thu Oct 16 00:08:31 EDT 2003 | Dean
Why would you have troubles if and when you switch? Isn't that the point of materials evaluation? Understanding the impact and material capability BEFORE "betting the farm on it". I would never stake my career on a solder paste without an Engineer
Electronics Forum | Tue Oct 21 18:30:30 EDT 2003 | russ
AXL, you could be right! I personally didn't switch they did it after i left. Is it possible that indium might have changed in the last couple of years? I remember Indiums specs stating 40% post residue? This was quite a bit higher than some othe
Electronics Forum | Wed Oct 15 09:32:51 EDT 2003 | russ
It is a direct switch over from what I have experienced. You don't need to change anything. You should expect to see a shinier/brighter joint. We actually consider them totally interchangeable with no worries about running either on any product.
Electronics Forum | Wed Oct 15 18:18:09 EDT 2003 | russ
Gabe, Interesting, I have never encountered that before. Why would you think we have never seen it? I would think that the increase in wetting would help "pull" the solder onto the leads reducing bridging. Am I wrong? Russ (not a rocket scientis
Electronics Forum | Wed Oct 15 19:11:40 EDT 2003 | dlkearns1
Can also reduce leaching of certain types of components. Also, dont expect to see a "shiny/bright" joint if running Nitrogen in the relfow unit, you'll see a dull/smokey like joint...if running Air then sure,let SHINE! my 2Cents DaveK
Electronics Forum | Wed Oct 15 12:38:56 EDT 2003 | mrulien
We have CM's that manufacture products and have established global FPY goals (across all products). My question is, how can I determine if the established goals are appropriate to meet my final quality expecations (at the customer)? Are there indus
