Electronics Forum: 10 (Page 1741 of 1927)

Re: Gold Finger Wear

Electronics Forum | Wed Dec 20 21:01:12 EST 2000 | Dave F

Talk about glam jobs � About once a month, we�d go over to the slaughter yard to get cows� teeth for Dr. Mueller. Then we�d fixture them on their side and run them in a machine that scrubbed them with a brush for weeks. The cool thing about cows te

Re: silver finishes on pcbs

Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB

Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol

Re: Solder paste recovery

Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman

I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could

Your next plant

Electronics Forum | Mon Nov 06 12:01:47 EST 2000 | Chad Pawlak

Late last week 10% of the population of Thorp, WI lost their employment. Saputo Cheese of Montreal Canada, formerly Stella Foods and formerly Blue Moon Cheese announced it will shut the doors to this 70 year tradition on Jan 3. Leaving in its wak

Re: Stencil Cleaners

Electronics Forum | Tue Nov 07 10:09:51 EST 2000 | Kevin

John, Depends on what you're cleaning (paste, adhesive, ink, etc..) and your process (do operators just dump a dirty stencil in and expect a clean one out, drying time, effect on the polyester). I could suggest a couple of name brand cleaners, but I

Re: How to do with tombstoning for component '0402'

Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem

All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr

Re: BGA on IPII

Electronics Forum | Mon Oct 30 13:26:09 EST 2000 | stefano bolleri

Ramon, I have placed BGAs before with an IP-2. It can be done, but with limitations: IP-2 can only see shape of BGAs, not balls (back-light only). Is this OK for you? I only placed components with balls having 50mil pitch, and the centering with bod

Re: HELP ( SOLDERING ISSUE)

Electronics Forum | Mon Oct 30 16:00:30 EST 2000 | Finepitch Services

Sal, I kind of assume you have paste there to start with... Because sometimes the edge components do not have paste applied caused by the bottom support in the screen printer etc. And if that is the case for one direction, the other direction applie

Micro solder balling

Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina

Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone


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