Electronics Forum: 10-3 (Page 1 of 2)

SMT component handling

Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3

What's the best company for low volume, quick turn around PCB assembly?

Electronics Forum | Fri Jan 08 01:24:34 EST 2016 | sunnyduan

What's the best company for low volume, quick > turn around PCB assembly? > > Why do you choose > their service over others? What's the cost > ballpark for 10 3"x3" boards assembled? > What's the best company for low volume, quick > turn arou

IPC610 spec's.....Am I the only confused one???

Electronics Forum | Wed Feb 24 07:56:53 EST 1999 | Brian C

Under IPC-A-610 Section 10.3(Components on their sides) it reads: ______________________________________________________ Acceptable - Class 1,2 Nonconforming Defect � Class 3 Chip components on its side provided the following are met: Chip

Re: IPC610 spec's.....Am I the only confused one???

Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader

| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are

What's the best company for low volume, quick turn around PCB assembly?

Electronics Forum | Fri Oct 30 16:12:45 EDT 2015 | billthebuilder

What's the best company for low volume, quick turn around PCB assembly? Why do you choose their service over others? What's the cost ballpark for 10 3"x3" boards assembled?

intermetallic question

Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef

You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1

What's the best company for low volume, quick turn around PCB assembly?

Electronics Forum | Thu Jun 01 16:05:27 EDT 2017 | stephendo

What's the best company for low volume, quick > turn around PCB assembly? > > Why do you choose > their service over others? What's the cost > ballpark for 10 3"x3" boards assembled? Most likely the one closest to you physically. But in any ca

Profiling LQFP-144 with ground plane

Electronics Forum | Mon Feb 28 21:30:34 EST 2022 | emeto

Couple notes here: 1. Try to shoot for 250C peak temperature. 2. Use all your 10 zones in profiling for more accurate profile. You should not reach your highest temp in zone8. Try to reach it in zone 10. 3. Go quicker. Your profile might be too long

Reflow Incoming Chilled Water Temp

Electronics Forum | Tue Jul 13 13:37:23 EDT 2010 | pjc

That's cold compared with this specification from a leading oven mfr.: Flow Rate - 1.0 - 3.0 US gal/min (3.79 - 11.4 l/ min) • Inlet size and pressure - 0.5 in. male NPT; 310 - 483 kPA (45 - 70 psi) • Pressure drop - 200 kPa @ 11.4 l/min (30 psi @ 3

Re: Mil-P-28809

Electronics Forum | Fri Oct 08 02:19:01 EDT 1999 | Brian

| Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. | | Thanks, | Mike Demos | MIL-P-28809 is definitely obsolete. Not only obsolete, it was possibly the most scientifically flawed standard ever to to be printed. I

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