Electronics Forum | Tue Mar 06 04:58:58 EST 2018 | reckless
My wish would be to put 2-3 smaller 4 nozzle/7000cph desktop units and not in line saving me changeover time. Mostly because of the small real estate footprint. I can put one next to my office running 110V/350W - its small enough to fit on my desk
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Mon Jul 05 18:40:24 EDT 1999 | JohnW
| Dear All, | | We are a medium sized Electronic manufacturing company manufacturing computer motherboards and Telecommunication products. We have a big debate going on within our company regarding the defect rate measurement technique. | | At p
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching