Electronics Forum | Mon Sep 28 12:43:48 EDT 1998 | Manish Ranjan
Hi Everybody My company is looking to buy some precision measurement systems to measure the height of flip chip bumps (nominal height of 100 microns). We are looking for a resolution of about 2 - 4 microns. Any help would be appreciated. Thanks Man
Electronics Forum | Tue Dec 04 06:16:50 EST 2001 | Andy
For conventional QFP device, what is the optimun height between lead and pad? 50 microns or 100 microns? What is the factor affecting this height?
Electronics Forum | Wed Aug 19 06:40:06 EDT 1998 | G Thomas
Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. Must be resistant to solvents such as MEK and acetone. Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Wed Mar 16 02:06:13 EST 2005 | amstech
What is the joint stand-off gap anticipated after the board level assembly and reflow? If it is designed per CSP standards, there should be no issue in water cleaning. If the gap is 90 � 100 micron, better to go with a no clean paste. His needs good
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Fri Jan 28 04:03:51 EST 2011 | grahamcooper22
Print then dispense in the areas you need extra paste. Why can you not use a stencil which has areas etched away around component patterns to thin the stencil down....for example a 150 micron thick stencil etched to 120 or 100 microns in specific are
Electronics Forum | Tue Oct 13 04:34:53 EDT 1998 | Sanjay Bhatikar
Sir, I have been thinking about your problem. I have a suggestion that may work, although it has not been tried before. How about using two stencils? First print the the whole board with a stencil for 150 micron thickness. Next, place a ste
Electronics Forum | Wed Sep 30 08:57:40 EDT 1998 | Eyal Dickerman
| Hi Everybody | My company is looking to buy some precision measurement systems to measure the height of flip chip bumps (nominal height of 100 microns). We are looking for a resolution of about 2 - 4 microns. | Any help would be appreciated. | Th
Electronics Forum | Thu May 04 04:29:05 EDT 2023 | abhishek10
we have observed a Field claim in ECU where root cause is Lead lift found in one of the IC. What could be the possible reason for lead lift and how to avoid the same in future. QFP is the Type 1.Checked the Part Library(3-D Check Refernece no.-23
