Electronics Forum | Fri Jan 24 17:00:56 EST 2003 | razan3
RMA needs to be dry prior to the wave to work. If coverage is good and part orientation is good, then you should be okay. Pad size can be adding to the amount of material left as well. Granted it soldered before fine with .2 long leads, I would di
Electronics Forum | Fri Jan 24 11:45:58 EST 2003 | Randy Villeneuve
I am not familiar with your flux but with no-cleans (which I use) the primary cause of icicling is the amount of flux solids left on the board prior to wave and how long the board is in the wave (2.5 to 3.5 seconds should be OK). The amount of flux s
Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
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