Electronics Forum: 10390 230 260 (Page 1 of 2)

Profiling for Pb-free HASL

Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork

Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 17:24:51 EST 2007 | dave

250-260ish seems a little on the high side ? Depending on the board density and components 230-245 should suffice. Again time above is usually preferred between 30-90secs but again it really depends on the PCB Dave

BTU Paragon 150 Reflow Oven

Electronics Forum | Sun Apr 23 09:07:42 EDT 2006 | kanna

i have one problem here with BTU TRS-14. we encounter Over temperature Alarm trigger when run lead free product. our profiling peak temp is 230 degree's and the temperature set point at zone 4 top/bottom is 260 degree's. can any help on this issue

Lead-free solder

Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken

What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n

Component size on double-sided PCB

Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob

UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,

BTU Paragon 150 Reflow Oven

Electronics Forum | Sun Apr 23 09:04:36 EDT 2006 | kanna

Does anyone have any experience with these ovens > ? We are looking at purchasing a used > one. Anything in particular I should look at > when inspecting it ? > > Any comments good or bad > appreciated..... > > Thnx, Sr. i have one problem he

New Oven Now Getting PCB Twist

Electronics Forum | Tue Feb 24 14:08:46 EST 2009 | swag

I think you are too hot out of the gate as well as too slow on conveyor. I think settings similar to 130, 140, 150, 160, 230, 240, 260 and conveyor speed at about 28 or 29 IPM would be more realistic but it depends on your paste and oven config/zone

rigid-Flex board via problems

Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef

Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1

Wave soldering PWB with foil surface.

Electronics Forum | Wed Apr 24 21:34:01 EDT 2002 | davef

Search the fine SMTnet Archives. Guidelines * Control: Flux specific gravity, preheater temp, conveyer speed, solder temperature. * Two most important parameters are: solder temperature & dwell time * Contact time. The optimum contact (dwell) time

Recommended Reflow Benchtop Oven

Electronics Forum | Fri Aug 30 02:12:19 EDT 2013 | raqz

Hi! I have been studying the reflow process. And now, I am researching for a recommended reflow oven that can process a small to low-medium production SMT soldering. For the experts in the reflow field, please recommend a reliable reflow oven. Here

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