Electronics Forum | Fri Sep 28 16:49:48 EDT 2007 | davef
good * No IMC => bad Intermetallic growths are diffusion limited, and therefore the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m^2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the act
Electronics Forum | Wed May 27 16:39:33 EDT 2009 | rmitchell
Hi, I think vision 20 will work as well. If not we have used 100 or 105. Have you tried placing the part with the machine trace on? If so is it finding all the leads? any error codes? If you are defining the leads in the EL lead data I would not d
Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter
Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these
Electronics Forum | Thu Nov 15 10:19:05 EST 2012 | davidmercader
Hi, We have problems with our wave soldering process. The problem is that during the same assembly, after wave soldering, some pcb’s look not clean and other pcb’s look good. We use lead free SAC305 solder and flammable flux. We think our proces
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Tue Jan 05 07:48:39 EST 2021 | mbass
Go for Gen 2 NT feeders, the Gen 1 Feeders tend to be problematic the older they get whereas the Gen 2 feeders are a much better prospect. I've used 8, 12, 16, 24 and 44mm. Some problems to look out for is pull back of coverlay and removal of waste
Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper
Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Wed May 26 13:30:58 EDT 1999 | JohnW
| we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any obv
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
