Electronics Forum | Tue Jan 16 13:48:51 EST 2001 | cebukid
...but with this new version of SMTNet, none of the links on archived messages work!!! It keeps saying "parameter incorrect."
Electronics Forum | Wed Jan 17 08:33:29 EST 2001 | cebukid
I'm using Netscape browser. When I click on the archive links, it opens another window which says "parameter incorrect."
Electronics Forum | Mon Jan 22 21:30:41 EST 2001 | dason_c
I had my experience when I run the Motorola BGA and I am not sure the voiding was created due to the incompatible flux residue. Rgds. Dason.
Electronics Forum | Mon Jan 22 22:37:27 EST 2001 | davef
50 ppm oxygen was on half joints reflowed in air. 3d Human factors PCB pad cleanliness: Handling of bare board pads creates excessive voiding. Print rejection: Cleaning of OSP pads with acetone or isopropanol increases voiding.
Electronics Forum | Thu May 03 17:34:57 EDT 2001 | oscar mendez
Does any one experienced problems on BGA voids related to height of chip (placement), and also another question, Does any one has some statistical process control for the BGA soldering process? if the answer is yes, I'd like to have advice from you.
Electronics Forum | Tue Jan 16 14:10:14 EST 2001 | bdoyle
what was the error message you were receiving? I just did a search for BGA in the forum using the search on the gray bar at the top and it yielded 71 results. I didn't have any errors when I clicked on them. Email me if you have continued troubles
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
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