Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Thu Jun 12 00:20:41 EDT 2014 | jasmine01
How to limt my Cisco WS-C3560X-48T-S switch port to 128kb which running 12.2(55)SE3 ? Could anyone help with the IOS commands needed to achieve this ?
Electronics Forum | Thu Jun 12 00:27:29 EDT 2014 | jasmine01
How to limt my Cisco WS-C3560X-48T-S switch port to 128kb which running 12.2(55)SE3 ? Could anyone help with the IOS commands needed to achieve this ?
Electronics Forum | Wed Aug 18 02:17:37 EDT 2010 | tennythomas
I heard that one can create the stacked/staggered microvias in the layers 1-2 & 2-3 and skip microvia in the layer 1-3 of 6 layer stack up, when the prepreg is between layers 1 & 2 and the other prepreg is between the layers 2 & 3. I want to know w
Electronics Forum | Tue Aug 03 16:52:41 EDT 2004 | Dreamsniper
Hi, What contributes to the above? I've got some BGA solder joints with a crystal like flux attached to it like a mini solder ball but do not have a perfect round shape. I had my aqueous cleaner's DI water sent for analysis and everything looks okay
Electronics Forum | Fri Jan 02 17:47:21 EST 2004 | gpaelmo
Yes, We have done away with masking with kapton 8 yrs ago. As long as the goldfingers are leading edge you can use one of these: 1. rubber goldfinger boot/glove - contact east use to carry them...don't know if they still do. 2. fiberglass glove - ma
Electronics Forum | Tue Apr 18 07:46:30 EDT 2017 | pavel_murtishev
Dear PCBFOX, I use CAM350 v12.2 build 1135. I am trying to use CAM350 DFMStream module for paste mask layer check. Examination I am interested in most of all is "Paste Mask Layer Check - Missing Paste Mask on SMD Pads (MP)", i.e. missing stencil ape
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
Electronics Forum | Mon Oct 20 14:56:51 EDT 2014 | rgduval
Progress!! Somehow, this morning I was able to get things almost working. I swapped cards 1 and 2 back, and then back again, so, in the same state as my last reply...set the default settings for the axes configuration...then, verified the addresses
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
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