Electronics Forum | Fri Oct 20 10:15:13 EDT 2006 | wrongway
mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil stencil and did some home plate style of cut outs in the stencil for the 1206 caps and resistors it seemed to fix our mid chip solder balls
Electronics Forum | Fri Jul 18 16:02:25 EDT 2008 | wrongway
I think Real Chunks has your answer home plat or reverse home plate or like we use a 10% reduction on most aptures vs pad I think your problem is to much paste on the pads we used to see a lot of that with 8mil stencil thicknes on our 1206 caps went
Electronics Forum | Sun Nov 12 21:28:09 EST 2000 | Rchard Eigner
We are manufacturing a PCB that uses an integrated circuit that has a leg spacing of 10 mils, other components on the PCB are 1206's and 0805's. Is it possible to make the stencil apertures 10 mils apart or is there another way of making the stencil.
Electronics Forum | Wed Jan 22 13:31:23 EST 2003 | jonfox
Elongated slots!! Our older runs are a pain sometimes with parts (1206, 0805 chips) twisting as they go through cure. I'm sure that its not all due to the dots, but I'm sure that it doesn't help either. We don't see this effect on our runs that us
Electronics Forum | Sun Mar 14 19:23:30 EST 1999 | Al
Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably g
Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Tue Mar 15 08:02:36 EDT 2011 | davef
Yes, you can reflow solder SMT parts with pads designed for wave soldering [including 1206] providing that you design your stencil apertures properly. It's a momma, poppa, baby bear situation. * Wave solder sized apertures will put too much paste on
Electronics Forum | Fri Oct 01 13:37:27 EDT 2004 | rkevin
Well Thanks for all the good advise. Lots of different opinions on this one. I took the advise to contact my current supplier of solder paste. They sent in one of their tech people along with a sales guy and we ran without much trouble. Other than a
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
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