Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Sat Mar 12 03:04:25 EST 2016 | sophyluo1985
Hello Everyone, We have Assembleon AX501 machine available for sale. Please kindly contact us if you are interested in. Thank you very much! sophy_smt@126.com
Electronics Forum | Thu Jun 20 05:09:41 EDT 2002 | mattiasw
I am running a VisionPoint AOI equip. from DiagnoSYS, and I have a question regarding the calibration of brightness on the cameras. When I run system Calibration to check the camra brightness I should have the following values: Cam#1=126 Cam#2=126
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Mar 17 07:42:51 EST 2006 | vicknesh28
Copper is the base material for the lead. It's tin/lead plated. I finally got profile. Here are the parameters" Peak : 219 Max (+) Slope : 2.29 Max (-) Slope : -1.94 Time above 200 deg. C : 50s Time 140C - 160C : 126s Additional info : Stencil thic
Electronics Forum | Fri Feb 09 03:03:29 EST 2018 | robl
Hi SuMoTe, Maybe a lot cheaper to go to a connector manufacturer and buy your pins from them - most standard 2.54mm pin headers use 0.64mm square pins (0.025" = 0.635mm), that are 12.6mm (0.5") long. Perfect. They will be plated with a solderable
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
