Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef
Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori
Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef
Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering
Electronics Forum | Sun Mar 15 23:02:16 EDT 2015 | louisg
Thank you Dave! Does that imply that test socket cleaners use a more aggresive/corrosive activator to remove the oxides?
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
Electronics Forum | Thu Jul 24 22:58:13 EDT 2008 | davef
At the 2004 IMAPS Nordic Conference, Claus W�rtz Nielsson from Nokia Mobile Phones published "The Evolution of Surface Finishes in Mobile Phone Applications" [www.imaps.org/adv_micro/papers/Nordic2004paper.pdf]. Some of the results were: * Corrosion
Electronics Forum | Tue Dec 28 10:57:53 EST 1999 | Amy Castor
I have tried the water soluble flux and the aqueous cleaners but I got the same results you did; horrible corrosion and a white flaky mess. I know exactly what you're talking about. We do a lot of hand soldering around here, and the magical solutio
Electronics Forum | Thu Oct 28 11:41:21 EDT 2004 | Steve Stach
Hello Loz, Blue residues on circuit boards can be caused by copper corrosion, component body deterioration, marking permanently, and adhesive break down. In this case, a more subtle mechanism appears to be possible. This is a no clean application
Electronics Forum | Wed Oct 15 07:31:29 EDT 2008 | davef
Similar to Jax's comment, concern yourself with the the activity level of the flux. A more active flux would be more aggressive in removing tarnish. Certainly, the choice depends on the type and amount of tarnish. Probably, you need to consider your
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
