Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Mon Jun 26 03:00:15 EDT 2000 | armin
Hi, Anybody there running GSM1 UPS Rev 1.4 with OS/2 4.0 Warp ? We have OS/2 2.11 and we plan to upgrade to OS/2 4.0 Warp. I'm afraid of some incompatibility issues might occur. Please feedback any incompatibility issues you encountered in case you h
Electronics Forum | Mon Dec 22 16:20:03 EST 2014 | warwolf
Basically the contract comes first, then the design drawings then IPC. if your costumer is asking you to bend the PCB then it becomes apart of the design drawings. as for looking for a cover, get it in writing that that's what they want you to do. I
Electronics Forum | Fri Feb 15 14:38:59 EST 2013 | bmario
Hi, We are having a problem with the interpretation of the surface evaluation criteria of J-STD-003 section 4.2.2.4.2. "A minimum of 95% of each of the surfaces (i.e. each pad) being tested shall exhibit good wetting. The balance of the surface may
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Wed Apr 26 14:06:46 EDT 2006 | mdm4ua
Hi JEM, We just made the very same upgrade you are looking to make on three machines. We purchased a new MY12 and upgraded our other three (My9 W/hydra, My9 No Hydra, and TP9-2U) from 2.2.4C to 2.4.4c. There are several changes and most of the
Electronics Forum | Wed Aug 22 07:24:34 EDT 2012 | ericrr
how about this for resistor & capactors with 4mm pitch, all measurements in millimeters. cell A1 "Input inside diameter" answer in cell B1 cell A2 "Input outside diameter"answer in cell B2 cell A3 "Input layer width,(from inner to outside layer) (no
Electronics Forum | Thu Jul 18 12:44:24 EDT 2013 | ericrr
after checking two computers, did not find it. However after using "google" found it in a flash. (less than 0.22 seconds) using a spreadsheet. how about this for resistor & capacitors with 4mm pitch, all measurements in millimeters. cell A1 "input
