Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Mon Dec 22 16:20:03 EST 2014 | warwolf
Basically the contract comes first, then the design drawings then IPC. if your costumer is asking you to bend the PCB then it becomes apart of the design drawings. as for looking for a cover, get it in writing that that's what they want you to do. I
Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef
Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect
Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef
Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.
Electronics Forum | Fri Mar 23 19:50:57 EDT 2007 | Frank
Possible head combinations to pick from multiple 12, 16, or 24mm feeders. Note: you can not mix feeder sizes for simultaneous picks. KE-2010 and KE-2050 will use 1&3, 2&4, or 1&4 KE-2020 and KE-2060 will use 1,3,R or 2,4,R or 1,4,R I prefer to s
Electronics Forum | Tue Apr 25 16:44:12 EDT 2006 | russ
Why do you want to switch?, are you having problems with 2.2 that you know 2.4 will fix?
Electronics Forum | Tue Jan 06 04:37:21 EST 2009 | janz
Tack test - follow IPC standard TM650 #2.4.44. Regards Janz
Electronics Forum | Tue Feb 09 12:47:56 EST 2010 | swag
Refer to the thread started by Deni on 2/4/10. Your problem is similar.
Electronics Forum | Mon Jun 26 03:00:15 EDT 2000 | armin
Hi, Anybody there running GSM1 UPS Rev 1.4 with OS/2 4.0 Warp ? We have OS/2 2.11 and we plan to upgrade to OS/2 4.0 Warp. I'm afraid of some incompatibility issues might occur. Please feedback any incompatibility issues you encountered in case you h
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
.gif)
.gif)
