Electronics Forum | Mon Nov 09 10:36:01 EST 2009 | jjfullers
We use the very common industry standard Loctite 3609 (RED) chipbonder in our process. However, one of our new customers requires that we build on RED PCB fabs. Thus our challenge when trying to inspect the bottomside epoxy. ANYONE KNOW OF ANY OTHE
Electronics Forum | Mon Jul 13 08:36:56 EDT 2020 | autisndong
Is there any tool or process you would recommend that can take a standard stack of Gerber files (usually 2-layer, although the potential capability to support 4-layer would be nice) and bring them all together into one set of Gerber files on a combin
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Wed Oct 28 07:26:19 EDT 2009 | julie331975
I don't like these boards for a couple different reasons. 1. They may be fine functionally but they look like crap. 2. What is our customer going to think when we deliver boards that look like this? They will probably wonder the same thing I do...
Electronics Forum | Tue Jan 17 14:59:03 EST 2023 | symakhan
Hello Again A few days ago, I posted about Solar panels installation in my construction project. I got amazing response from everyone. I am grateful for all the advice and suggestions. I am also sharing all the details here in hope they will be help
Electronics Forum | Tue Oct 27 22:52:18 EDT 2009 | davef
Top picture: We're not wild about the 'poor registration,' the differing thickness of the solder mask, and the crud all over the board. But, then again, we don't have a basis for rejection. Bottom picture: No basis for rejection Help us out, what do
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Fri Aug 18 03:34:20 EDT 2006 | ridzal
i want to know about some basic details of materials in pcb such as CEM, FR1, FR2, FR3 and XPC.The use, advantages and also disadvantages
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Fri Sep 01 05:29:01 EDT 2017 | mona0312
Hi, Recently, i found a company called "jlcpcb". It’s very cheap 10pcs boards. 1.2mm thick, 1-OZ copper, 6/6-mil outer (0.1525mm) just cost $2 Cheap price and lots of options regarding board thickness, colour, etc. None of my boards have ever had a
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