Electronics Forum: 2 part potting dispensing (Page 1 of 14)

time/pressure dispensing

Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef

We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C

Heat transfer properties of encapsulate potting material.

Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00

I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone

Re: Need a UV resistant black potting material

Electronics Forum | Fri May 28 12:51:11 EDT 1999 | John Thorup

| Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to

Fuji FCP 2 Check Servo issue

Electronics Forum | Thu Sep 16 18:43:57 EDT 2010 | slwolbert

Hello Daxman, Thanks for the input. Yes, the CP2 is closely related to the CP4 and does have the analog servo amps as you deduced. I did a wiggle test on the connectors and found that the x-y-r servo amp alarmed right away and blinked the x axis a

Stacking/piggyback chip.

Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer

We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta

compactflash memory process requirements

Electronics Forum | Mon Apr 22 09:07:43 EDT 2002 | pjc

Francis, The potting encapsulation process was in the mfg. of flash-disk devices built on a DIP formfactor. Compact flash do not normally get potted. Ultrasonic welding or snap-togther is methods for closing the compact flash housing. The potting mat

Universal 4713D Adhesive Dispenser Disposal

Electronics Forum | Tue Apr 28 19:43:25 EDT 1998 | Michael Allen

I'd like to find a buyer for the following used equipment: Make: Universal Instruments Model: 4713D Adhesive Dispenser Options: Rotatable dual-dot head (0deg, 90deg) Price: Asking $4K (No reasonable offer refused) I should note that this d

Re: Use of chip bonding adhesive.

Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper

Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th

Potting/Conformal Coating

Electronics Forum | Fri Mar 04 08:25:57 EST 2016 | esoderberg

Try Humiseal 2A53. This is a very old 2-part epoxy coating that is still used by a number of companies as well as the military. Very hard to rework, transparent and may be what you are looking for

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

  1 2 3 4 5 6 7 8 9 10 Next

2 part potting dispensing searches for Companies, Equipment, Machines, Suppliers & Information