Electronics Forum | Thu Aug 11 15:11:35 EDT 2011 | davef
Franx: In response to your follow-up questions ... For the case 1: Q1: Should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). A1: Correct. Glue can be stencil printed, dispensed, or pin t
Electronics Forum | Thu Aug 11 07:01:34 EDT 2011 | franxsmt
Thank you very much for your informative and helpful reply. I have a few more questions:) 1- So for the case 1: should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). If so, I would guess
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Tue Dec 23 15:06:25 EST 2008 | evtimov
It depends how manual is the printer. you need to control pressure and speed. If you control both by hand, it is difficult to discuss results. If the pressure is controlled by the printer, than you should be able to do it by one deposit. Also is the
Electronics Forum | Wed Dec 24 20:11:43 EST 2008 | xianhua_tang
hi,brettc! Our stencil openings no more than 4mm * 4mm, you have a larger component of the pads is more than a 4*4? At the same time, with the thickness of the stencil, I would like to increase the printing speed can be improved to reduce the thickne
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Tue Dec 23 14:45:06 EST 2008 | comatose
One thing that helps is to divide large pads into a series of smaller pads. This prevents the scooping you're talking about.
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Fri Aug 23 01:40:14 EDT 2019 | sssamw
Such huge difference between low and high thickness will definitely cause paste accumulation on the squeegee side. Normally is 2 mil max difference.Yes, dispense maybe help for thicker paste or print two times.
