Electronics Forum | Wed Jun 16 15:31:47 EDT 1999 | JERRY JOHNSON
WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. CAN BOARDS BE RUN
Electronics Forum | Sun Dec 07 16:26:52 EST 1997 | George Henning
First Responses Lost: Please Repost | Looking for info on process flow for 2 sided SMT with PTH | on the top side. | Both sides have large SMT ICs. I don't know what the best approach is; | Epoxy, Paste in Hole, High temp paste. | Any info appreciat
Electronics Forum | Tue Jan 30 10:29:08 EST 2001 | sim_ad
How can you do an assembly with BGA on both side?
Electronics Forum | Tue Jun 03 10:30:36 EDT 2014 | cbeneat
We have the same ovens, our 2 sided boards have the same profile for both sides. Haven't seen a problem in 8 years.
Electronics Forum | Tue Jul 13 09:16:13 EDT 1999 | Dick Casagrande
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Wed Jun 16 15:44:52 EDT 1999 | Jagman
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Fri May 27 14:00:57 EDT 2022 | SMTA-64387182
I am looking for some sample assembly notes for a 2-sided PCBA IPC Class 2. Notes to put on my assembly drawing. Not the PCB fab drawing. Thanks, Joe
Electronics Forum | Mon Apr 02 10:50:39 EDT 2007 | CAN
We have simmilar probelms with a GSM. Lie to it and tell it there are less pins. If there are 6 pins on each side tell it there are 4 and to ingnor the outer 2. then it may miss the dot. Or have it look at just 2 sides like a SOIC.
Electronics Forum | Mon Jul 10 15:43:49 EDT 2000 | JAX
Mark, As far as what is the correct way; No Harm, No Foul! Adhesive bonding is more susceptible to damage caused in transportation of product; even from one side of the building to the other. This is why it is general practice to run it last��Smaller
Electronics Forum | Thu Jun 26 07:20:09 EDT 2003 | emeto
Hello, What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject
