Electronics Forum | Tue Jun 09 08:15:48 EDT 1998 | John L. Neel
Hello, Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the time, bu
Electronics Forum | Wed Jun 10 10:28:48 EDT 1998 | Steve Schrader
| Hello, | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the time
Electronics Forum | Fri Jun 05 06:20:19 EDT 1998 | Terry Keen
I am currently reading as many articals as I can to familiaize myself with Surface Mount Technology. My company is planning to install a SM production line by the end of the year. Here is one of my questions. I have read that one of the specification
Electronics Forum | Sun Jun 07 19:09:21 EDT 1998 | Graham Naisbitt
Chiakl Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it will b
Electronics Forum | Thu Jun 04 11:23:44 EDT 1998 | Frank S
If you could measure and chart 3 variables in my process, what would they be? The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure 7"
Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M
Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The
Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Tue Jun 02 12:58:07 EDT 1998 | Michael Allen
"...the part is aligned to the pads with in 10% before going into the IR oven." Sounds like the pad pitch might be okay (?). If that's not the problem, then what? I wish I had the answer, because I've struggled with heavy QFPs for some time now (2
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
