Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef
2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers
Electronics Forum | Wed Oct 16 13:16:11 EDT 2002 | davef
Hey Mar, Sounds serious!!! Poke around Buehler, Leco, or Struers Try IPC TM-650 Test Methods Manual: 2.3.6A Etching, Ammonium Persulfate Method - 7/75 2.3.7A Etching, Ferric Chloride Method - 7/75 2.3.7.1A Cupric Chloride Etching Method - 12/94
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Thu Jun 14 20:56:02 EDT 2001 | davef
See, now you know how you got the job!!! ;-) Assuming you mean solder mask, that stuff is designed to be tough to remove. It�s an epoxy meant to protect the board features from the ravages of board fabrication and everyday life. Your choices are:
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
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