Electronics Forum | Wed Feb 04 08:39:46 EST 2009 | smartasp
Hi The issue is not the equipment or any other technical matter. The point is that the argument is about the 10 deg C higher melting point. The process window of SN/CU is somewhat smaller but manageable. I know Nihons web site but found not enough i
Electronics Forum | Thu Nov 08 18:10:19 EST 2018 | slthomas
I spend more time doing program management than I do process stuff now so I'm constantly flying by the seat of my pants, but when push comes to shove and I have to resolve something technical (like, immediately) I usually end up back here asking myse
Electronics Forum | Wed Apr 28 08:01:25 EDT 2021 | mikekeens
Hi,I have been investigating this machine for the past month and technically i am impressed with it's capabilities. It seems easy to program and does all this things i would need. I'm still in process of evaluating other machines so have yet to mak
Electronics Forum | Fri Apr 18 09:16:59 EDT 2008 | samir
Yes, BLAME. It's a common theme in manufacturing unfortunately. Also, unfortunate, is that the PROCESS is the easiest thing to blame and often the path of least resistance to the non-technical manufacturing personnel (operations managers and line s
Electronics Forum | Wed Jul 12 21:47:41 EDT 2000 | Dave F
Celiav: Mark is probably spot-on on his comments about a board fab problem. It is weird that you have similar problems from two suppliers though. Recommendations are: � Get rid of any bird brain contractor that installs processes that affect your
Electronics Forum | Wed Mar 14 22:41:03 EST 2001 | CAL
There are also Process monitoring tools that mount directly to your blades and monitor the paste. Impedance Spectroscopy is the process monitoring theory behind the tool. It works by having good sample data logged that the monitoring tool can compare
Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson
I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y
Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler
We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.
Electronics Forum | Thu May 08 10:43:03 EDT 2003 | stimpy
Nice sugestions from all.. but one simple solution that you should practice from here on out.... CFM... If you would have built up your process, you would have found the flawes there early allowing you to correct the process flow. I would use CFM on
Electronics Forum | Sun Feb 29 23:15:14 EST 2004 | Ken
I have found that during the interviewing process you need to include your technical staff to get to the nuts-and-bolts of what your looking for. Plus, team involvement spreads the responsibility for selecting the "right" candidate. Recently duri
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