Electronics Forum | Mon Aug 11 04:08:52 EDT 2008 | janet200701
we want to estimate the price of assemblyng a > board that contain both SMD and THT component . > and also we have the BOM file of this board . > please help me There is 3part on the cost: 1. PCB cost 2.Assembly cost 3.components cost. If you w
Electronics Forum | Wed Jun 30 14:06:24 EDT 2010 | jax
I assume you are talking about a Foreign Object Elimination checklist... It should include: 1. Date 2. Shift (if applicable) 3. Section designee 4. FOB Monitor 5. Supervisor 6. List of items being checked... ex. 1. "FOE bags are available and i
Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Thu Jul 18 13:11:56 EDT 2002 | gdstanton
Steve, We are touching up 6 - 12% of all solder joints processed. We consider the solder joint to be the focal point of the SMT process. Therefore our metric is based on it. For example in a given month we... 1. Assembled 25pcs of 'A' (IPC-A-610/J
Electronics Forum | Wed Apr 19 11:50:05 EDT 2006 | amol_kane
Hi BJ, Everyone's favourite answer...it depends! If the volume if large, masking boots will save you both, time and money in the long run. Custom boots are relatively expensive to buy, but they pay themselves over time by savings on masking tape. ma
Electronics Forum | Mon May 17 10:59:02 EDT 2021 | kumarb
Hi. Have an Emerald-X machine with FNC purchased refurb from Assembleon with mixed results at 3500 hours. Had it sitting idle for years due to assorted issues after their installation. Only now after much time and parts investment have the machinery
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
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