Electronics Forum | Mon Apr 26 03:00:43 EDT 2010 | fujiphil
Check the following... 1. Set the fiducial reading to SCAN... 2. Clean the half mirror of the fiducial camera... 3. Check the CCD Camera...maybe blown fuse inside. Hope this will help.... Good luck....
Electronics Forum | Fri Oct 28 10:58:26 EDT 2011 | emeto
Hi, 1. Lubricate X shafts or gears or whatever you have on the machine. 2. Clean X encoder 3. Change motor 4. Change card
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Mon May 19 18:10:43 EDT 2003 | msjohnston
A chemical change is needed to reduce VOC�s in our spray-in-air stencil cleaner. Items that are to be considered to effectively find a replacement chemical that works as well, or better than the current chemical include, but not limited to, the foll
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim
As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with
Electronics Forum | Sat Jul 02 10:27:19 EDT 2022 | madisreivik
Hello ! I got exp only with leadfree HASL, but maybe the same problems apply. Also, the leaded HASL has probably lower process temperature. This could be copper, which has settled to the tank bottom. With leadfree, the copper is removed from molten
Electronics Forum | Thu Jan 23 14:19:56 EST 2003 | Mike Konrad
Hi Randy, No-clean flux needs to be activated in order to burn off the volatiles in the flux. This normally occurs partly during preheat and certainly during the reflow or soldering process. In most hand soldering applications, an operator applies
Electronics Forum | Wed Mar 14 17:52:49 EST 2001 | davef
6 Work Life Test 6.1 Obtain a stencil with 15 to 20 rows of a series of 0.025 by 0.050 inch apertures spaced 0.050, 0.040, 0.025, 0.015, 0.010, 0.010, 0.025, 0.040, 0.050 inches apart. See Appendix 1. Source of supply: Metal Etching Technology.
