Electronics Forum: 2.lead and 20mm (Page 1 of 1)

Fuji Pick and Place Machines

Electronics Forum | Sat Jun 05 08:18:03 EDT 2004 | vinitverma

Hi Grant, If you're really looking for speed, I'm sure you're looking for another machine for doing the QFPs, BGAs stuff etc. In that even, why not have a look at the long proven Assembleon FCM machine!! It is a totally different concept with UNMATC

The truth about lead-free and environment

Electronics Forum | Fri Mar 24 09:33:26 EST 2006 | Rob

Hi Samir, That's cos it's already an offence to sell such an item in the EU. If you even paint a childs toy with a coating of more than 0.2% lead you can face 2 years in prison (admittedly with 3 nice meals a day, internet access, gym etc - I think

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james

We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Tue Jan 23 17:48:17 EST 2007 | GS

for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Also IEC 60286-2 (leaded components like axials, radials,..) Regards......GS

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