Electronics Forum | Sun Oct 15 23:31:39 EDT 2000 | mkwong
I have a question for N2 reflow, I want to know how difference of the O2 PPM in reflow oven then get the result? Now, we use the N2 to purge into BTU oven and measure the O2 PPM is about 1,000. but cannot find the difference to compare to compress ai
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Wed Jul 31 13:09:17 EDT 2002 | gdstanton
Anyone have experience with Indium NC-SMQ92J solder paste used in an inert (N2) reflow oven?
Electronics Forum | Tue Oct 17 18:36:49 EDT 2000 | Philip Reyes
Yeo, These are possible rootcause of that defect and you can evaluate. 1. Orientation of the capacitor, maybe the cap is located behind big component. 2. Reflow profile, check the profile on that side. 3. Yes, check also the mounting force. Philip
Electronics Forum | Sun Jul 14 22:28:37 EDT 2013 | cedric77
1.Weight the paste 2.reflow the paste 3.clean the residue from the reflow ingot 4.weight the ingot By using simple calculation we can extract the percentage of metal or flux loading from the solder paste.
Electronics Forum | Tue Feb 13 05:11:58 EST 2018 | ameenullakhan
Hi, We are using 10+2 reflow oven ( BTU Pyramax 150 ). We have tried with short TAL ( RTS profile too ). As of Now we are using the attached profile, which has given us lot better results. But the issue is not eliminated. Thanks
Electronics Forum | Thu Dec 19 18:44:06 EST 2019 | tey422
We opened 2 separate holes at the roof. 1 for the SMT 2 reflow ovens to share; another 1 for the wave soldering.
Electronics Forum | Tue Apr 18 07:19:19 EDT 2023 | bukas
hi, does anyone know what type is Carlo Gavazzi sensor on REHM SMS2 reflow oven? The only marking I see on one I have is "Tripleshield tm"
Electronics Forum | Wed Mar 11 17:32:46 EDT 2015 | jlawson
Small paste deposits have less flux thus less flux activity to enhance the wetting. So preheat needs to be as short as possible, ramp to spike if possible. Try not to ramp hold and spike - pending thermal delta on product can be made to ramp to spike
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
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