Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Tue Oct 17 18:36:49 EDT 2000 | Philip Reyes
Yeo, These are possible rootcause of that defect and you can evaluate. 1. Orientation of the capacitor, maybe the cap is located behind big component. 2. Reflow profile, check the profile on that side. 3. Yes, check also the mounting force. Philip
Electronics Forum | Tue Feb 13 05:11:58 EST 2018 | ameenullakhan
Hi, We are using 10+2 reflow oven ( BTU Pyramax 150 ). We have tried with short TAL ( RTS profile too ). As of Now we are using the attached profile, which has given us lot better results. But the issue is not eliminated. Thanks
Electronics Forum | Sat Jul 31 23:39:53 EDT 2004 | Bryan Sherh
Dears, Is there any LGA775 socket (Tejas) in your products?or process?Here are some issues that I met in my process,need your help and hope it benefits someone. 1.Because the socket body is really very big and weighs about 37g,need special L size No
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Fri Feb 01 17:53:19 EST 2013 | hegemon
In agreement with Evtimov. Max 5 reflow cycles. Something like this scenario: Build bottomeside 1 Build topside 2 Reflow topside for suspect opens beneath BGA 3 Remove BGA during rework 4 Replace BGA during rework 5 Any convective rework after that,
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince
The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
