Electronics Forum | Sun Jul 18 21:36:42 EDT 2004 | KEN
This is the least desirable method (mirroring). 1. X-ray inspection becomes difficult. I will repeat: x-ray inspection becomes difficult. False fails go up. True fail detection goes down. 2. Remove and replace becomes challenging. You really
Electronics Forum | Mon Nov 26 20:15:50 EST 2001 | davef
Sounds like you are thinking correctly. I'd guess your fab has gotten "smart" and changed your bare board, as you suggest. So, you've got two choices: 1 Rework the QFP. 2 Remove the lower temperature PTH components and solder them to the board some
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Thu Sep 16 21:28:44 EDT 1999 | JAX
| I have a number of hopefully easy questions: | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others?
Electronics Forum | Mon Sep 23 12:58:13 EDT 2002 | dragonslayr
Methusala was very old yet he is still talked about thousands of years later. In my perspective, age of a thread is not the issue. It is the careless resurrection of a non-active subject that causes waste of time and space that is the issue. I can
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Thu Aug 13 19:54:01 EDT 2015 | aemery
The camera assembly is designated as X23; the stencil & board lighting as well as the camera video signal pass through the DB9 connector at the camera. There is a ribbon cable in the vision gantry tray that carries both to the box on the left side o
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 09 04:08:45 EDT 1998 | Thomas Blesinger
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
