Electronics Forum | Tue Sep 09 13:03:19 EDT 2008 | logannsan
What is this? I thought 63sn 37pb was the norm. What is with the 2 at the end? Anyone know?
Electronics Forum | Tue Sep 09 16:39:03 EDT 2008 | vladig
As far as I know, they rarely do it with Pb-bassed solders. Pb-free may contain Cu or Ni (to improve test performance) Vlad
Electronics Forum | Wed Sep 10 16:53:46 EDT 2008 | realchunks
Actually it's not rare. I use several pastes from various manufacturers that add 2% silver in their leaded pastes. I would bet it's 2% silver.
Electronics Forum | Wed Sep 10 17:08:08 EDT 2008 | slthomas
Isn't that the non-eutectic one that provides the pasty phase range that people use to clobber their tombstoning problems?
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Mon Jul 15 11:36:18 EDT 2013 | rgduval
Some great legal language here, Dave. Guess some people don't like their knowledge being shared. Probably shouldn't publish it to the interwebs if that's the case.
Electronics Forum | Tue Oct 08 10:16:39 EDT 2019 | leeg
We used a similar part and adjusted the routing so that the front edge of the connector was supported and therefore keeping the connector flat and it not being able to tip forward. I don't know if this is something that you can do with your board?
Electronics Forum | Fri Nov 13 03:57:41 EST 1998 | Steve Cheung
We are experiencing 'lifting' on one or more sides of a QFP. Poor lead co-planarity has been ruled out by independent tests. Please tell me which of the two remaining failure modes is the most probrable? 1. Expansion of gases in vias underneath devi
Electronics Forum | Fri Aug 26 22:12:27 EDT 2005 | iwan
Folks, I have been trying to get information about Malcom SP2 Solder Paste Softener spin speed from Internet and still waiting from supplier. Does anybody know about that one spin speed info? Also how to determine spin time to get a good paste base
Electronics Forum | Tue Nov 01 08:50:26 EST 2005 | James
I've recently been subjected to a procedure that requires the first 2 solder paste prints of a production run to be wiped down and not used for the build. This is to condition the stencil aperture walls? and insure good print deposition. Is this a
