Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Tue Sep 09 16:17:45 EDT 2008 | boardhouse
Logannsan, you may want to check into this a little more with your customer to find out what 2 is. It could be as Vlad say's 2Ag -silver, or it could be 2CU -copper or 2Ni- nickel. Also check this form for 62Sn 36Pb 2Ag just my 2 cent. Regards
Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson
We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu
Electronics Forum | Mon Apr 19 02:38:41 EDT 1999 | Brian Sloth Bentzen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Dec 22 06:46:01 EST 2011 | rameshraja
Dear All, We are doing PCBA's manufacturing,Inprocess we are doing manual soldering, reflow and wave soldering process, As per ISO-7.5.2 Process validation ( Special process ) Soldering process is considered as an special process, hence in order to
Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef
Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile
Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
