Electronics Forum | Thu Oct 03 10:21:30 EDT 2019 | cbart
Hello all!! we are having a heck of a time getting a TE Connector to solder TE P/N 2305018-2. the part design is terrible!! the parts tips forward and rocks side to side when mounted. we are getting many un-soldered leads. and the design does not len
Electronics Forum | Mon Sep 12 05:43:53 EDT 2011 | aungthura
Hi All We have run the Hast Burn-in-Board into 2 soldering Process,first-Reflow and second-Wave. After wave soldering, there are many insufficient solder in the via holes.The via holes are wide as 15mil. Then, as customer's request, we have to cover
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
Electronics Forum | Wed Mar 20 11:14:15 EST 2002 | cfraser
Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest way to remove a chip is with 2 solder irons. Place one iron on each end of the component. This process is completely safe and takes about 2 seconds pe
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
