Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan
Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Fri Jul 16 10:55:54 EDT 1999 | Jeff Ferry
We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads a
Electronics Forum | Thu Jul 22 03:58:28 EDT 1999 | George Verboven (Process Engineer)
| We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads
Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ
So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common
Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin
No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than
Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
