Electronics Forum | Fri Jul 18 12:16:06 EDT 2014 | island2013
I had the same situation at a facility a few years ago. We moved our wash from one building to another and it was fine for months and then we had the foaming issue similar to yours. We tried everything from adding anti foam agents to even having th
Electronics Forum | Wed Jun 16 13:05:19 EDT 1999 | Clifford Peaslee
Brian, Depending on where you are, the traffic "route" is different. This is what I have: (TRACERT SMTNET.COM) 2 10 ms 10 ms 10 ms 7507port02-atm.maine.rr.com 3 20 ms 90 ms 20 ms sl-gw7-nyc-6-1-0.sprintlink.net 4 20 ms
Electronics Forum | Mon May 25 04:51:44 EDT 2009 | microdot
hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small pcb. the picture i have enclosed is used to remove the but when we tried to solder the chip using the same profile..it didnt work. Can anybody suggest
Electronics Forum | Fri Mar 17 07:42:51 EST 2006 | vicknesh28
Copper is the base material for the lead. It's tin/lead plated. I finally got profile. Here are the parameters" Peak : 219 Max (+) Slope : 2.29 Max (-) Slope : -1.94 Time above 200 deg. C : 50s Time 140C - 160C : 126s Additional info : Stencil thic
Electronics Forum | Tue Jul 19 12:43:05 EDT 2016 | cyber_wolf
A 200% + increase in load time certainly erases any thoughts of efficiency in my mind.
Electronics Forum | Wed Aug 04 10:20:13 EDT 2004 | santech
I am looking for an inexpensive way to mark pcb's. Anyone out there got any ideas? I need to print out 2-5 characters on an array of 40-60 boards. currently using silk screens and an old screen printer, but I can see that in no time I will have ov
Electronics Forum | Thu Dec 15 19:47:43 EST 2005 | Liza
Hi GS, You mentioned that polystyrene should be sealed by low method. We are currently using the ffg parameters for polystyrene monolayer dull finish carrier tape and AA cover tape. Are these considered low by standard? These are the parameters r
Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Thu Jun 19 12:40:09 EDT 2008 | realchunks
If I read this right, it says 50 seconds or less above 200C. It doesn't say you cannot go above 200 C. Right? if so we do it all the time. We have some Quality gurus here that always blame our ovens for everything form a didle-I-Joe to a Dam-If-I
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
