Electronics Forum: 2000 (Page 144 of 505)

Re: PPM for SMT Placement

Electronics Forum | Mon May 08 16:26:29 EDT 2000 | Travis Slaughter

A common formula and perhaps more telling would be 1 defect for each solder joint and each part. For example a 1206 resistor could be 3 defects, a QFP128 could be 129 defects.

SMT Placment Reliability

Electronics Forum | Thu May 04 12:15:32 EDT 2000 | Charles

There is a hypotheses floating here that the more surface mount components on a PCB, the percent of missplacments goes up. I'm on the receiving end of this, and looking for backup, or argument for the idea.

Re: SMT Placment Reliability

Electronics Forum | Thu May 04 16:00:07 EDT 2000 | Nick

A Machines reliability will remain the same If it places 25 parts or 25,000 parts. It has nothing to do with "how many parts" but on the repeatability of the machine type. You would notice less misplacements on a low count PBC due to seeing less comp

Re: SMT Placment Reliability

Electronics Forum | Sat May 06 08:05:31 EDT 2000 | Dave F

Charles: I don't know about machines doing what you're talking about, but I sure I know that I do!!!! Good luck. Dave F

Re: Stencil Marking

Electronics Forum | Fri May 05 08:35:42 EDT 2000 | Aerin Bryson

We engrave a kind of 'dog tag' which we attach on to the frame.It's fairly visible. You need to put it on somewhere that doesn't get in the way - depends on your equipment. You can also use it to give the operators an orientation for loading the st

Re: Stencil Marking

Electronics Forum | Thu May 11 17:30:19 EDT 2000 | Tekguy2000

I use a label printer. You can get different colors to denote top and bottomside or expoxy if you screen it. Will not wash off in cleaner and last virtually forever.. Will peal off if needed..

High Temp Past

Electronics Forum | Wed May 03 17:40:06 EDT 2000 | Steve B.

Does any one you High temp past for bottom side surface mount components instead of using adhesive. We are having components falling off be for we wave, the problem is that we need do a lot of thru-hole assembly before waving. Thanks for your help.

Re: High Temp Past

Electronics Forum | Wed May 03 21:07:36 EDT 2000 | Eric Chua

Hi Steve, I had face problem before. What I did, add addition process which is screen print that apply adhesive. During thru-hole assemble, the components hold strong by the solder. Try this.

Re: PASTE LEACHING

Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca

Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes

Re: PCB Offset

Electronics Forum | Wed May 03 16:33:27 EDT 2000 | Mark

Panasert tech support is 800 308 0891. It is 24 /7 and offers pretty good service. On the MV100 I'd ask for Pete Turner.


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