Electronics Forum: 2000 (Page 220 of 506)

Re: Fine Pitch

Electronics Forum | Thu Nov 30 21:45:44 EST 2000 | Dave F

It's unlikely that anyone other than the biggest of whooses would think of 0.031" a fine pitch. I prefer 0.025" on tape with solder plated copper leads make in a shape that bears-up well after being driven over by a Mack truck, yet is compliant enou

Re: Beginner advise

Electronics Forum | Thu Nov 30 21:23:44 EST 2000 | Dave F

Design more products and get wealthy. Don't waste your time and energy in areas that others are accomplished. A friend designs boards, sells $10M [what that is in euro, funny money, I don't know or care] of them a year, with a company of five [in

Manual reflow using hot air.

Electronics Forum | Wed Nov 29 20:32:08 EST 2000 | irwanm

I'm new in SMT and the company I'm working with has already purchased SMFL-3000 manual pick & place system with hot air and we don't have reflow oven. We are now starting design SMT board. My question is, how we reflow the solder? After all component

Re: Manual reflow using hot air.

Electronics Forum | Thu Nov 30 23:31:49 EST 2000 | CAL

Dave F- FYI SMFL3000 is a manual placement/ reflow machine from Dima SMT (WWW.DIMASMT.com)origin, the Netherlands. In the USA Manncorp Reps Dima. I would reflow each IC component by itself and do an isolated mass reflow on the chips, then run to a s

Process Characterisation

Electronics Forum | Wed Nov 29 06:38:18 EST 2000 | Chris May

Dear People, Can anyone point me in the right direction. I am involved in manufacturing low volume (batches of 4-20) pcb's. I have been investigating Process Characterisation ref EIA/JEDEC PUBLICATION 132. For such a low volume scenario, has anyo

Siemens HS50 and F5 and S25

Electronics Forum | Mon Nov 27 16:31:07 EST 2000 | Chris Jackson

I am evaluating several pieces of Siemens equipment and would like to get some input from industry users. I am seeing that Siemens is able to meet cycle time estimates and thus throughput. I am concerned about the robustness?? Any input is welcome. T

Re: Black spot on Gold Pads

Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K

Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with

reflow profile

Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY

Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th

Re: reflow profile

Electronics Forum | Fri Nov 24 07:10:39 EST 2000 | Chris May

Sarry, Word on the street is that your profile will have to be hotter, maybe up to 20C hotter, I have trialled lead free. The sales guy said, "Right, lets reprofile your oven ! I said, "No, lets try it as it is.....! The results were fine, as the

BGA Rework station

Electronics Forum | Tue Nov 21 22:46:32 EST 2000 | Chryzs

Hi! Does anybody kow about a bga rework station that accurate and does the job (as possible) in one axis (no table moving after chip placing ... Something very accurate (I'm using a SRT Pinnacle 500 and it's not ok... NOT AT ALL) Thanks a lot! chry


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